Giga3D

3D Non-Isothermal Device Simulator

The Giga3D module extends Device3D by incorporating the effects of self-heating into a device simulation. It includes models for heat sources, heat sinks, heat capacity and thermal conduction. Physical and model parameters become dependent on the local lattice temperature where appropriate, allowing the self-consistent coupling between the semiconductor device equations and the lattice temperature.

Key Features

• Self-Consistent Lattice Temperature solver
• Thermodynamically correct modelization
• Coupled to Drift-Diffusion or Hydrodynamic equations
• Able to model steady state, transient and small signal a.c. biasing
• Default parameters for thermal conductivity over a range of materials
• Default parameters for heat capacity over a range of materials
• Lattice temperature dependence for a wide range of parameters
• Joule and Peltier/Thomson heat generation terms
• Flexible boundary condition specification
• Choice of non-linear solvers for coupling to drift-diffusion equations
• Anisotropic thermal conductivity tensor
• Flexible thermopower specification, including phonon drag

Rev. 011108_01